QianLi Solder Explosion Proof 24K Gold-plated Foil (0.08mm) for Motherboard Soldering

Brand: QianLi Thickness: 0.08mm

Description: The 24K gold-plated foil is needed for solder explosion when reballing, tin adhesion, and avoiding pressing due to a crooked motherboard. Improve working efficiency for the master lower skill dependency for the green bird. Highlights:

- 24K gold-plated process.

- Better anti-oxidation and conductivity.

- Achieve a more stable solder explosion-proof. Feature:

- Support middle frame, chips, and BGA.

- Clamp the foil as easily as falling off a log.

- The backbone of the precise electronics hardware.

- Small size and great efficiency, solder explosion-proof.

- Applied to all electronic components required lamination.

- More stable alignment, motherboard slight deformation worry-free. Packing includes: 0.08mm *3 bottles