AMAOE BGA Reballing Stencil With CPU Position HU4 for Huawei HiSilicon

- The Repair tools made of high-quality materials and durable in use.

- Well-designed heat dissipation holes,very good heat dissipation, not easy to bulge, high success rate of tin planting.

- Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh.

- High-grade quality, 0.12mm thick.